About Flexible solar cell
The solid mechanics module in COMSOL Multiphysics (v.5.6) was used to simulate the stress of a two-dimensional silicon wafer with the length and thickness set to 1 cm and 60 μm, respectively. T.
Large-scale atomic/molecular massively parallel simulator (LAMMPS) package47 was used to perform atomistic simulations of mode I loading on c-Si nanofilms with sharp and r.
An in situ bending test of a c-Si foil was conducted on an FEI Tecnai F30 TEM system using an.
Load–vertical displacement (F–D) curves of 4 cm × 2 cm × 140 μm textured c-Si wafers were obtained using a commercial Discovery DMA 850 instrument (Suppleme.
The elastic strain distribution in the fractured c-Si wafers was mapped using GPA on the basis of the individual high-resolution STEM images. GPA, which was done on th.
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